Is that possible both solder joint bridging and open solder joint defect happen at same BGA (Ball Grid Array) or CSP (Chip Scale Package) device?
bga package 在 電子製造，工作狂人 Facebook 的最佳貼文
bga package 在 TrendForce Facebook 的最佳解答
"Owing to the feature of NAND Flash and the development of 3D-NAND, the SSD density with BGA package keeps increasing. Under the demands of lightweight, high capacity and high speed, it is expected that the market share of this kind of product will increase gradually in consumer products such as PC and tablets."from #DRAMeXchange, a division of #TrendForce.
bga package 在 電子製造，工作狂人 Facebook 的最讚貼文
《舊文複習》一般我們較常看到的SMT貼片方式都是一個蘿蔔一個坑，就是一塊地只能有一家透天的平房，不過近來電子零件封裝的技術日新月異，再加上尺寸被要求越做越小，所以也常常看到有利用電路載板打上零件後再當成一般SMD零件貼在最後電路板上的設計，如LGA封裝就屬於這類的技術，另外在零件上面再打上另一顆零件也時有所聞，比較常聽到的是BGA零件上頭再打上另一顆BGA，俗稱為這樣的封裝技術為PoP(Package on Package)，就類似蓋大樓，一塊地上面可以蓋兩層樓以上。
bga package 在 Why is eMMC in a BGA package, despite only using ... 的推薦與評價
BGA packages also have very low pin inductance values, which are desirable for high frequency operation, even if the required number of pins is ... ... <看更多>
bga package 在 What is BGA Package? | PCB Knowledge - YouTube 的推薦與評價
BGA is short for Ball Grid Array. It changes the original J-leads on a dual in-line package or gull-wing leads on the flat package to solder ... ... <看更多>